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Title:

[QUOTE=Guest;110172]Jitender Pratap Singh
 
[b]Mail [/b]: j_psingh74 AT yahoo.co.in 
 
SUMMARY
MBA with Masters Degree in (manufacturing Management) from BITS PILANI. 16 years of rich experience having varied industries exposure in the following technologies like--
- SMT (surface mounted technology- memory division).
- Semiconductor/COB-Chip on Board- micro SD, SD & Micro UFD.
- BOM (Blank optical media) & SSM (Solid State Media including UFD, Micro SD & Micro UFD).
- Photovoltaic-Flat Panel & Concentrator PV- Low CPV & HCPV.
KEY SKILLS
 Operations Management
 New Project/ Plant Set Up / Relocation
 Technology Transfer
 Manufacturing Relocation Study
 Machinery Selection
 Reverse Engineering Project Transitions
 Vendor Development
 Productivity/ Yield improvement
 Process flow mapping/Layout Designing
 DFM-Design for manufacturability
EXPERIENCE SUMMARY
Name of the Organization Industry Type Designation Key Role Duration
Moser Baer Photovoltaic India Ltd. Manufacturing of blank optical media, Solar panels, solid state media-UFD, Micro SD, SD & micro UFD Asstt. General Manager New Project set up / Relocation/ Technology transfer/Product Development/operation management/Project management/program management Nov’04 - Till Date
Celetronix India Ltd Manufacturing – High End SMTs/ Mother Boards/ COBs Assistant Manager Operation/project Management June’02 to Nov’04
Team Asia Lakhi Semiconductor Ltd Semiconductor – Small signals & IC manufacturing Assistant Manager Operations Management Feb’01 to May’02
Continental Devices India Limited Semiconductor - SMT Assembly Head Operations/project Management Oct’94 to Feb ’01
EXPERIENCE DETAILS
Moser Baer India Ltd / Moser Baer Photovoltaic India Ltd ([url]www.moserbaer.com[/url])
Moserbaer is world’s 2nd largest manufacturer of Compact Disc (Blank Optical media). Moser Baer has diversified its operations into solar application including Flat panel, concentrator PV & thin films technology.
Company has diversified its business to SSM (Solid State media), whereby it is producing UFDs
(Universal Flash Drives), SD cards, Micro UFD & Micro SD cards.
Currently responsible for operations & new project management. Heading 75 technical staff upto manager level & 300 Operators upto technician & Sr. Technician level.
Growth Path 
 Since June’10 Assistant General Manager 
 Mar’08 – May’10 Senior Manager 
 Mar’07 – Feb’08 Manager 
 Mar’06 – Feb’07 Deputy Manager 
Nov’04 – Feb’06 Assistant Manager 
Contributions
 Leading new project set up and transition activities for high capacity manufacturing lines. This includes machinery selection, Identify the equipment & equipment suppliers, technology transfer, negotiations, manufacturing layout planning, process mapping etc.
 Performing Production start up and managing technology transfers of Solar Projects (high concentrator and low concentrator) from USA to India in 06 months of time frame.
 Conduct business analysis for transition, risk management & delivery.
 Managing Vendor development for low cost automation & raw material supplier for solar projects.
 Established & support raw material localization sources to minimize the logistics cost.
 Performing cycle time & touch points study for productivity enhancement. Identify the bottleneck thru line balancing techniques.
 Preparation of high level transition costs during solution design phase, training methodology, identifying risks and deliver to SLA expectations. 
 Managing budgets and keep cost under budget. For example, project set up of SMT line under 7.0 million USD & that of Micro SD & COB UFD under 10.0 million against a target capex of 10 million & 13 million respectively.
 Manage complete end to end operations of solar panels, SMT UFDs, micro SD and CDs/DVDs.
 Member of the steering committee of the cost saving projects at the company level.
Key Initiatives / Projects Handled
Project Handled Key Points
New Project set up- memory & storage products 
- Leading end to end project setup of SMT UFD line. Line capacity to produce 70K output per day. Capex involved USD 07 Million against a budgeted capex of 10 million USD.
- End to end project set up for COB and Micro SD line. Capex incurred USD 10 Million against a budgeted capex of 13 million
- Key activities include project planning, machinery selections, negotiations, manufacturing layout, process mapping TO & T1 sample generation & hand over the line to production.
Technology Transfer –non conventional energy product
 - Production startup of high concentrator photovoltaic solar panel line in India, Technology transfer from USA. Line capacity to produce 8 MW solar panels per annum.
- Production startup of Receiver Assembly for High Concentrator Photovoltaic solar panels in India. Technology transfer from USA. Receiver assembly constitutes approximately 60% of the BOM cost.
- Technology transfer of packaging of UFD & micro SD from USA & Germany.
Reverse Engineering-non conventional energy product - Perform Reverse engineering of Receiver assembly to reduce the cost of the solar panel by 25%. Outsourcing done utilizing SLA approach. Localization done in 40% lesser cost.
- Reverse engineering includes, BOM finalization, process flow creation, TO sample preparation, Interim reliability & long term reliability etc.
Feasibility Studies- Alternate energy source/consumer electronics/memory products - Feasibility study completion of Primary mirror manufacturing line for high concentrator Photovoltaic from USA to India. This ensured cost saving of approximately 20%.
- Feasibility study completion to produce low concentrator photovoltaic. Successfully developed proto samples of 2X concentrator of 2.5 W using half amount of silicon. 
- Feasibility study for the development of pico projectors- stand alone & pocket type, having Lumen level ranging from 10-20 Lum
- Feasibility study of Injection molded sim card.
Other improvement projects
 Improve the screen & squeeze life in CD printing process from 50K/screen to 150K/screen.
 Reduce thermal Adhesive consumption in solar panel by 50% by alternate dispensing designing to save the cost ~ 300K USD per annum.
 Reduce the consumption of Die attach paste in semiconductor process by 20% thru alternate dispensing profile slection which resulted in cost saving by 100K USD per annum.
 Saving Ink Consumption on CD printing by 2 fold by reducing the thickness from 20micron to 10 micron by adopting different mesh count & adjusting machine parameters.
 Reducing the rejection from 5000ppm to 2000ppm of printing process of CD/DVDs.
 Productivity improvement of packaging of UFD by 20% thru in-house jigs fixture modification. Reverse engineering of various tooling to save the cost ~ 100K USD per annum.
 Change the set up & change over time from 30 min to 10 min using SMED approach.
Accomplishments-patents 
 03 patents applications have been filed in India, Japan, Europe, China & USA. 
- USB perforations – 20090216-008332-001 
- LED placement – 20090409-008332-002 
- Reflective casing – 20090409-008332-003
 Selected as key resource of the company consecutively 2nd time.
 Selected outstanding Manager of the year amongst 40 managers & DGMs across all organizational verticals.
Celetronix India Ltd- now Jabil Group ([url]www.jabil.com[/url])
Company has the Manufacturing facility in (US, Singapore & Cylon).The company is the leading & India’s largest manufacturer of Head Stack Assembly, SMPS ,High End SMTs, Mother Boards ,COBS, Set Top Box. 
 Growth Path June’02 – Nov’04 Assistant Manager (Equipment Maintenance/Operations)
Contributions
 Responsible for the mechtronics maintenance and production of mother boards, SMPS & COBs.
 Maintaining preventive maintenance schedule of all the machine.
 Calculating MTTR, MTBF, MTBA equipment wise.
 Carry out droppage analysis.
 Bottleneck analysis to reduce the cycle time.
 Cycle time optimization to improve the productivity.
Key Initiatives / Projects Handled
 Reverse engineering of CP643 chip shooter machine head shaft to reduce the cost by 20K USD.
 Increase the productivity of SMT line by 20% by automating the UFD connector by machine.
 Process optimization thru better stencil designing, achieve the SMT yield to more than 99.5% continuously for more than one year.
 
Team Asia Lakhi Semiconductor Ltd
Company is having joint venture with IMP (International Micro-electronics products) incorporated USA & is the leading manufacturer of Discrete Semiconductors mixed type (40Million/month) and Analog ICs. (PDIP-8L, 14L, 16Leads, (3.0million/month).
 
Growth Path Feb’01 – May’02 Assistant Manager (Operations)
Contributions
 Responsible for the mechtronics maintenance and production of PDIP (8L, 14L and 16 leads ICs), TO-92, TO-220, TO-3C, TO-126, TO-3 and ISO TO-220 transistor outline packages. 
 Taking care of both Front of line & End of line operation & maintenance.
 Leading Continuous Improvement initiatives to ensure Productivity/Yield improvement by conducting various small improvement projects using Six Sigma methodology involving cross-functional team.
 Calculating MTTR, MTBF, MTBA equipment wise.
Key Initiatives / Projects Handled
Project Handled Key Points
Project set up 
- Project and process set up of TO-220 transistor package for M/s Semcon Devices Pvt Ltd. Subcontractor of Team asia. Plant was not in operation for more than 1 year.
 
Quality/ Yield and Reliability improvement. 
Process Optimization
 - First pas yield of the TO-220 transistor package was increased by 5% by the introduction of Cutter Test, Wetting Test, Wafer thickness measurement, new solder wire composition.
Devices never got failed in the reliability tests.
- Introduce TPM activities to reduce the set up time by more than 10%.
- Localization of Indexer assembly of TO126 die attach machine in india.
 - 
Accomplishments
 Awarded as best performer for quality/ yield and reliability improvement projects handled. 
 Localization of punch inserts of the cutting dies, localization of pot & plunger to reduce the cost by more than USD 40,000 annually. 
 Change the material of punch inserts of cutting dies from carbide to ASP-23 to reduce the cost by 50%, keeping the tool life more than 1.5 million cuts.
Continental Devices India Limited
India’s Leading semiconductor-manufacturing company, capacity to produce 40 million mixed type discrete products/month. 
 
Growth Path Apr’98 – Feb’01 Assembly Head (Operations)
 Apr’96 – Mar’98 Senior Engineer
Oct’94 – Mar’96 Engineer
Contributions
 Responsible for the Mechtronics Maintenance & Production of TO-92, TO-220, TO-3C, TO-126, TO-3 and ISO TO-220 transistor outline packages.
 Leading Continuous Improvement initiatives to ensure Productivity/Yield improvement by conducting various small improvement projects using Six Sigma methodology involving cross-functional team.
 Adopted new method of mold cleaning to reduce the lead frame cost by more than 5,000 USD annually.
 Improve the wire bonding process yield from 98% to 99.5% by optimizing the process parameters.
Key Initiatives / Projects Handled
Project Handled Key Points
Reverse Engineering 
- Feasibility study done to use Copper wire bonding instead of gold on TO-126 package.
 
Process Optimization
 - Reduce set up time of processes by 10%.
- Increase the punch inserts life of cutting dies to 1.5 million.
- Improve the yield of TO-220 die attach process by 1% by introduction of Cutter Test & Wetting test.
 - 
OVERSEAS SPECIALISED TRAINING 
 Six Sigma Green Belt Certified by Motorola University, conducted by Moser Baer India Ltd.
 Buy-Off Training in Korea for Automatic In-line Die Bonder & Wire Bonder for semiconductor plant.
 Visit to outsource the Assembly Test Mark & Pack (ATMP) facility of Spansion in Thailand.
 Buy-Off Training in USA for Technology transfer of High concentrator photovoltaic project. Successfully transferred the technology in four month period.
 Buy-Off Training in USA for Technology transfer of Low concentrator photovoltaic project.
 Buy off training in USA for the primary mirror plant.
 Technology transfer & buy off training in Germany for the packaging solution for Micro UFD.
 Technology transfer & buy off training in Italy for the packaging solution for UFD & Micro SD.
EDUCATION DETAILS
Education Details Institute / Specialization
Master in Business Administration (Finance) Institute of Advanced Studies in Education
Master of Science (M.S.) in Manufacturing Management (equivalent to M.tech) Birla Institute of Technology and Science (BITS, Pilani). 
[b]Specialization  [/b]: Manufacturing Management
It’s a four semester higher degree integrated learning program offered by BITS.
[b]Bachelor of Science (B.S.) (equivalent to B.Tech) Birla Institute of Technology and Science (BITS, Pilani). Specialization  [/b]: Engineering Technology
Engineering Diploma G.B. Pant Polytechnic
Specialization : Mechanical Engineering[/QUOTE]

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